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8090 – Large Area Wedge Bonder

The foundation for a vast array of wedge bonding solutions! World-leading speed and precision, in conjunction with the largest table travel in the industry, have established the K&S Model 8090 as the cornerstone for an ever-increasing number of fine-pitch wedge bonding applications. An X-Y table that delivers 0.1 μm resolution and a precision rotary bondhead, combined with a specially engineered cross-groove wedge and high-frequency transducer, allow wedge bonding at pitches signifi-cantly finer than any other large area wedge bonding solution available. What’s more, its architecture is adapt-able to almost any material handling challenge.
The 8090’s rotary bondhead attaches up to 5 wedge bonds per second; significantly faster than its competition.
he K&S Model 8090 combines 5 wire per second speed with a bonding area of 16″ (406.5 mm) x 14″ (355.6 mm) and fine-pitch capability to 70 μm, making it the fastest, most accurate, and most versa-tile large area wedge bonder in the entire industry

• Up to 5 bonds per second
• Wedge bonding to 70 μm pitch
• ±5 μm positional accuracy at 3 sigma
• 16″ (406.5 mm) x 14″ (355.6 mm) bondable area
• Adjustable angular feed of wire as fine 18 μm.

BOND HEAD

• Z Axis Travel
  • 12.7 mm (0.5″)
• Z-Axis Resolution
  • 0.29 µm
• Theta Travel Resolution
  • 0.04° / pulse (total of 360° rotation)
• Wire Size
  • Au: 18.0 to 50.0 µm
  • Al: 25.4 to 50.0 µm
• Wire Feed Angle
  • 38°, 45°, 60°, 68°
• Bond Speed Rate 5 wires per second (200 msec/bond) based on 2.5 mm (0.100”) wire and clamp tear

XY TABLE

• Bondable Area
  • 406.5 mm x 355.6 mm (16.0″ x 14.0″)
• Resolution
  • 0.1 µm
• Bond Placement Accuracy
  • 2.75 µm
• Bond Placement Repeatability
  • 1.84 µm at 1 sigma
• Bond Pitch
  • 70 µm at 3 sigma

VISION SYSTEM

• ESI Digital Vision System w/CCD Camera Pattern Recognition System Image Rotation Handling
  • ± 5° from taught image
• Tilt
  • ± 2° maximum

ENVIRONMENTAL SPECS

• Temperature Required
  • 15 – 30°C (59-86°F)
• Humidity
  • 30 – 70% Relative Humidity (non-condensing)
• Atmospheric Pressure
  • 540-810 mm Hg (21.2 – 31.9″ Hg)

UTILITIES

• Voltage
  • 100 to 240 VAC
• Frequency
  • 50-60Hz, 30 amp
• Power Consumption
  • 2.5 KVA nominal
• Air Consumption
  • 65 psi minimum at 5 CFM
• Factory Communications
  • Ethernet Interface (EIA RS-232-C) SEC I
  • RS-232 Interface
  • (EIA RS-232-C) SEC I
• Safety Protocol
  • • CE Compliant
• Dimensions
  • 43.5”(1105 mm) W x 55”(1397 mm)D x 70.5” (1792 mm) H
• Weight
  • Machine: 1,088 kg (2,400 lbs)
  • Crated: 1,270 kg (2,800 lbs)

OPTICS

• Magnification
  • 2X (4.5 um / pixel)
• Working Distance
  • 3.75 inches, aperture f 5.7
• Focus range
  • .5 inch (programmable focus)

MATERIAL HANDLING

Package Types

• Ceramic Substrates
• Snapstrates
• PC Boards
• Hybrids
• MCM
• Chip on Flex
• Smart Cards
• Chip on Board
• Chip on Glass
• RFID
• Leadframes
• BGA

Automatic Material Handling Options

• Material Width: 2” (51 mm) to 10.5” (267 mm)
• Material Length: 4” (102 mm) to 12” (305 mm)
• Boat Handling
• Custom Handling Solutions

Manual material handling options also available.