BOND HEAD
- Z Axis Travel
- Z-Axis Resolution
- Theta Travel Resolution
- 0.04° / pulse (total of 360° rotation)
- Wire Size
- Au: 18.0 to 50.0 µm
- Al: 25.4 to 50.0 µm
- Wire Feed Angle
- Bond Speed Rate 5 wires per second (200 msec/bond) based on 2.5 mm (0.100”) wire and clamp tear
XY TABLE
- Bondable Area
- 406.5 mm x 355.6 mm (16.0″ x 14.0″)
- Resolution
- Bond Placement Accuracy
- Bond Placement Repeatability
- Bond Pitch
VISION SYSTEM
- ESI Digital Vision System w/CCD Camera Pattern Recognition System Image Rotation Handling
- Tilt
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ENVIRONMENTAL SPECS
- Temperature Required
- Humidity
- 30 – 70% Relative Humidity (non-condensing)
- Atmospheric Pressure
- 540-810 mm Hg (21.2 – 31.9″ Hg)
UTILITIES
- Voltage
- Frequency
- Power Consumption
- Air Consumption
- Factory Communications
- Ethernet Interface (EIA RS-232-C) SEC I
- RS-232 Interface
- (EIA RS-232-C) SEC I
- Safety Protocol
- Dimensions
- 43.5”(1105 mm) W x 55”(1397 mm)D x 70.5” (1792 mm) H
- Weight
- Machine: 1,088 kg (2,400 lbs)
- Crated: 1,270 kg (2,800 lbs)
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OPTICS
- Magnification
- Working Distance
- 3.75 inches, aperture f 5.7
- Focus range
- .5 inch (programmable focus)
MATERIAL HANDLING
Package Types
- Ceramic Substrates
- Snapstrates
- PC Boards
- Hybrids
- MCM
- Chip on Flex
- Smart Cards
- Chip on Board
- Chip on Glass
- RFID
- Leadframes
- BGA
Automatic Material Handling Options
- Material Width: 2” (51 mm) to 10.5” (267 mm)
- Material Length: 4” (102 mm) to 12” (305 mm)
- Boat Handling
- Custom Handling Solutions
Manual material handling options also available.
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