AT – db – 105

The advantages

• Suitable for all common wire bonding processes
• Wire diameter 17 to 600 μm, max. ribbon cross-section 2,000 x 300 μm
• Quick and easy changeover in less than 15 minutes
• Large working range: 635 mm (X) x 350 mm (Y), 100 mm (Z); 25″ x 14″
• Continuous monitoring and control of the bonding process through patented Bond Process Control
• Wide range of automation options from manual to in-line, also combined or multi-track
• Variants for extremely high components up to 500 mm clearance height